Ib qho ntawm peb semiconductor cov neeg siv khoom lag luam-}}}}}}}}}} - qhov ceevMicrochanan Txias Txias TxiasUa los ntawm 6061-t6 aluminium. Cov khoom siv uas yuav tsum muaj dua1,200 micro- qhov, txhuaØ 0.18 hli, nrog aqhov tob - rau - dex dectio ntawm 10: 1, thiabKev Raug Ntawv Tshaj Tawm nyob rau hauv ± 5 μmhla txhua qhov chaw saum npoo.
Cov kev sib tw tseem ceeb suav nrog:
Tuam TxhabVim yog tus neeg paub ntau yam
Tswj xyuasqhov ncajtshaj li drilling ntev li drilling
Kom meejChip Tawmtsis muaj deforming lub micro - qhov
Kev Tiv Thaivthermal distortionThaum lub sijhawm khiav haujlwm tas li
Txhawm rau hais txog cov no, peb ua haujlwm:
Tshwj xeeb micro- tho kev toolingNrog rau sab hauv coolant raws
Ntau - theempeck drilling tswv yimnrog dwell thiab rettract tswj
Ultrasonic - Kev Pabcuam FlushingTxhawm rau kom pom tseeb
Hauv - txheej txheemThermal stabilizationntawm kev hla los tswj kev nthuav dav
Tom qab ntau yam iterations thiab simulations, peb tau siv siv a2-PAS Drilling thiab Reaming Cov Txheej TxheemQhov ntawd ua tiav lub qhov geometry thiab burr -} dawb hauv qhov chaw. Tshaj tawm - kev soj ntsuam kev soj ntsuam siv a500 ×Ua ntsuas tsomthiabCMM nrog kev sojntsuam scanningpaub tseeb:
Txhua lub qhov nyob hauv±3 μmzam nyiaj
Nto roughness hauv qab noRa 0.2 μm
- rau - lub qhov spacing sib txawv ntawm±4 μmHla ib 150 hli × 150 hli matrix
Cov khoom sib xyaw ua ke helium dej kuaj, thermal hloov kev sim ua hauj lwm, thiab tau txais rau cov neeg siv lub sim tsim tsis tau ua haujlwm.
