Hauv cov cuab yeej tshaj lij Semiconductor thiab Optoelectronic khoom, cov nyom mus dhau macroscale daim ntawv. Ntau yam sib xyaw - xws liKho qhov muag, Mem cov sensors, thiabLaser Lub Tsev Nyob-} koomSiab - precision microstructuresNrog sub - millimeter yam. Cov nta no xav tau kev sib txuas ntawmUltra - Kev daws teeb meem zoothiabMulti - Axis TswjFAR tshaj cov kev sib xyaw ua ke machining muaj peev xwm.
Qhov kev sib tw: geometry ntawm micro nplai
Complex microfeatures qhia ib qho teeb meem ntawm cov kev sib tw tsim khoom:
Microchhannels, nyias phab ntsa, thiab nkhaus profiles
Sub-100 μm thev tausHla ntau lub dav hlau
Kev pheej hmoo ntawmTuam deflection, Burration Tsim, lossisThermal Puas
Piv txwv li, hauv kev tsim covMem cov sensors siab, cov kab tsuag sab hauv yuav tsum muaj cov khoom siv thiab cov duab. Txawm tias muaj 10-micron sib txawv tuaj yeem cuam tshuam rau tag nrho cov cuab yeej rhiab thiab ua haujlwm.
Vim li cas cov cuab yeej ua tsis tau
Thaum siv cov cuab yeej cov qauv:
Oversized los yog bigid cutters uaTxheej txheem deformation
Tuam kev hnav lossis kev co tsimNto qhov tsis xws luag
Thaum tshav kub kub los ntawm machining ua rauwarping lossis delaminationHauv ntaub ntawv txheej
Qhov no yog qhov tseem ceeb tshaj plaws rau qhov chaw zoo liLaser Optics nkhauslossisCov Duab Ruaj Khov, qhov twg muaj kev cuam tshuam tsis txawv tuaj yeem ua rau muaj teeb liab misalignment lossis tsom ua tsis tiav.
Peb txoj kev daws teeb meem: mult - Axis Micro - tshuab xaws, calibrated rau precision
Ntawm Npis Xus Precision, peb siv:
5 {- Axis Micro-CNC Millinglos lis cov undercuts thiab compound kaum
Ultra - Cov Cuab Yeej Hluav Taws Xob Hluav Taws Xob (ø <0.2 hli)Txog siab -}} nov piv cov ntsiab lus
Tsawg - quab yuam txiav cov tswv yimthiabthermal tswjTxhawm rau tiv thaiv micro - deformation
Nto moo hauv qab ra 0.2 μmrau kev kho qhov muag lossis sealing aav
{- Lub Ntiaj Teb Daim Ntawv Thov: Mems Sensor thav ntawv
Nyob rau hauv ib kis, peb uaAluminium Mems Sensor TsevNrog rau sab hauv<0.3mm in width and wall thicknesses below 0.15mm. Through precision fixturing and in-process measurement, we maintained concentricity and flatness within 5 μm across 20+ cavities-without requiring secondary EDM or post-processing.
Ntseeg los ntawm high - tech innovators
Peb cov kev daws teeb meem micromaching txhawb:
Photonic sib dhos
Saciconductor Wafer Thauj caj npab
Laser Txoj Kev Sib Tw
Aerospace -} Cov Qauv Sensor Qib
Nrog rau kev nkag siab tob txog ob qho kev coj ua ntawm cov kev coj cwj pwm thiab cov neeg siv hluav taws xob txo qis - txoj cai los ntawm theem qauv qauv.
