Kev sib tw cov nyom ntawm cov tseem ceeb ntawm peb -} tiam semiconductors
Raws li cov cheebtsam tseem ceeb ntawm thib peb - prici carride cov khoom siv tsis zoo vim lawv corrosion tsis kam thiab siab thermal conductivity. Txawm li cas los xij, Silicon Carbide muaj lub hardness ntawm txog li hV2,002, thiab teeb meem xws li chipping, substardard flipness thiab ua tiav yog nquag tshwm sim thaum lub sijhawm ua. Cov txheej txheem tsoos yog qhov tsis muaj nqis thiab kim, uas tau dhau los ua qhov mob uas txwv kev txhim kho kev lag luam.
Hais Txog Qhov: Silicon Carbide Wafer Tov Chuck Ua
Ua cov khoom lag luam tsis sib xws
Khoom: Silicon carbide (sic)
Nta: Precision sib tsoo ntawm kab noj hniav thiab zawj qauv qauv
Qhov loj: Txoj kab uas hla 380mm × thickness 5mm
Kev nyuaj: HV2,002 (ze rau lub hardness ntawm ntuj pob zeb diamond)
Keeb kwm yav dhau los thiab kev ntsuas nyuaj
1.industry xav tau: Nrog cov qauv ntawm miniaturization thiab kev ua haujlwm siab ntawm cov cuab yeej cuab tam, silicon carbide cov cuab yeej thiab ultra {{0} high precision.
2.Processing nyuaj:
Siab chipping: Cov khoom muaj nkig, thiab kev txiav tawm tsis muaj zog tsis tswj hwm tau yooj yim ua rau ntug kev tsis xws luag.
Cov cuab yeej ceev: Lub neej ntawm cov cuab yeej ua yeeb yaj kiab yog tsawg dua 159 feeb, thiab nquag hloov cov cuab yeej cuam tshuam cuam tshuam ntau yam muaj peev xwm ntau lawm.
Tsawg efficiency: ib leeg {- teev siv li 888 feeb, uas yog qhov nyuaj kom tau raws li cov kev xav tau ntau lawm.
Npis XusKev daws: Ultrasonic prefing tshuab teev subverts cov txheej txheem ib txwm ua
Aiming ntawm qhov mob ntawm cov ntsiab lus ntawm Silicon Carbide ua, cov kev daws teeb meem bishen tau thov cov kev sib txuas tshiab tshiab:
Ultrasonic Precision Enggraving Thiab Milling: Txo kev txiav kev lag luam tsis kam thiab cov ntaub ntawv kev ntxhov siab los ntawm cov siab - zaus kev co, thiab buchpress chipping los ntawm qhov chaw.
TSEEM PCD micro - Hniav milling cutter: Txais polycrystalline pob zeb diamond (PCD) superhard cov cuab yeej ntawm micron qib, kev coj mus rau tus account hnav tsis kam thiab txiav kev ruaj khov.
Kev txawj ntse ua kom zoo ntawm cov txheej txheem tsis sib xws: Sib phim ultrasonic amplitude thiab pub nrawm kom ua tiav qhov sib npaug ntawm cov khoom tshem tawm thiab qhov chaw zoo.
Ob chav sib tawg hauv kev ua tau zoo thiab raug nqi
Tom qab ua ntawv thov cov kev daws teeb meem ntawm cov kev daws teeb meem, kev ua cov silicon carbide seem tau txhim kho ntau:
Tus lej chipping tau poob los ntawm 60%: Cov tshuab ultrasonic txo tau txiav cov zog los ntawm 45%, thiab tus ntug kev vam meej nce mus txog Ra0.2μμm tiav txheem.
Efficitais tau nce los ntawm 48%: Ib Leeg {-} Siv lub sijhawm ua tiav tau raug txo los ntawm 888 feeb, thiab cov peev txheej ntau dua ob npaug.
Tool Lub Neej: PCD cuab tam lub sijhawm ua haujlwm tau txuas ntxiv ntawm 159 feeb rau 317 feeb, thiab cov nqi ncaj qha raug txo los ntawm 35%.
Txog Ntawm Bishen
Npis Xus(Bishen thev naus laus zis) tau tsom rau qhov ntsuas hluav taws xob ntau tshaj kaum xyoo thiab tau cog lus los muab cov kev daws teeb meem siab, optics, aerospace thiab lwm yam kev lag luam. The company takes ultrasonic assisted machining technology as the core, combined with self-developed tools and intelligent process systems, to help customers break through efficiency bottlenecks and achieve domestic substitution of high-end manufacturing.
