Nyob rau hauv lub teb ntawm chip tsim, kev ua tau zoo ntawm ib leeg-siv lead ua silicon ib ncig raws li cov haujlwm tseem ceeb cuam tshuam cuam tshuam rau cov khoom siv semiconductor. Ib pob ntawm d360mm ib leeg-Crystal Silicor Silicon Rings ua tiav los ntawm cov txheej txheem nyias nyias, thiab yooj yim ncig lub voj voog, sab nraud lub voj voog, dav hlau thiab cov kauj ruam).
Ua cov ntsiab lus ntawm kev lag luam
Ib Leeg-Crystal Silicon Rings yuav tsum tau mus los ntawm ntau cov txheej txheem xws li thaib duab thiab xov, thiab lawv nyias-walling tsuas yog 1.2mm) yuav tsum muaj kev ruaj ntseg heev. Cov txheej txheem ib txwm siv sib tsoo cov log rau kev sib tsoo, tab sis muaj cov tsis txaus ntseeg:
Tsawg efficiency:Ib txoj kev siv sijhawm yuav siv sijhawm li 408 vib nas this, uas yog qhov nyuaj kom phim cov pawg ntau yam yuav tsum tau;
Cov khoom tsis zoo: Qhov roughness tom qab sib tsoo tsuas yog ra 0. 30μm, yuav tsum muaj polishing ntxiv;
Loj Tawm Los Poob: Tus lej chipping nyob rau hauv lub cheeb tsam nyias-phab ntsa ntau dua 15%, thiab cov khoom siv poob yog siab.
BISHEN DRABTS: Ultrasonic precision engraving thiab milling technology yog siv
Hauv kev pom ntawm cov yam ntxwv ntawm monocrystalline silicon, cov pab pawg bishen ua tau thov kev daws teeb meem kev lag luam tshiab:
Ultrasonic Precision Enggraving Thiab Milling: Txo kev txiav kev lag luam tsis kam los ntawm cov cuab yeej ua kom nruj yuav kom tsis txhob muaj zog ntawm cov qauv muaj yees;
DDR ntsug high-ceev spinTable: Nrog ntau-Axis Linkage Exportage tswj kev tswj, kom paub ib-lub sij hawm ua cov chaw sib txuas thiab txo cov clamping rov qab;
Mekas tej tsis: Txhim kho cov nqi pub thiab txiav qhov tob rau nkig thiab nyuaj cov yam ntxwv ntawm monocrystalline silicon.
Kev siv nyiaj ua ke los ntawm kev lag luam qauv
Cov ntaub ntawv ntau lawm qhia tau tias cov kev daws tshiab tau ua tiav peb qhov kev txhim kho tshiab:
Efficitais tau nce los ntawm 67%: Ib leeg siv sijhawm ua kom luv los ntawm 408 vib nas this mus rau 136 vib nas this;
Deg nplaim roughness txo los ntawm 80%: Mus txog ra 0. 06μμm, rooj sib tham ncaj qha ua ke yuav tsum muaj;
Ua tsis tiav qhov xoom: Ultrasonic thev naus laus zis tau zoo rau kev sib tsoo micro thiab nce cov khoom siv los ntawm 20%.
Txog Ntawm Bishen
Npis XusTsom rau kev tshawb nrhiav thev naus laus zis thiab kev siv khoom siv sib xyaw ua ke rau cov kev daws teeb meem siab, thiab tau cog lus rau cov kev daws teeb meem zoo, kev lag luam kho qhov muag. Lub tuam txhab pab pawg tau ua rau muaj kev koom tes nrog kev ua haujlwm ntawm Internhard cov khoom siv thev naus laus zis, thiab tau ua haujlwm ntau tshaj 100 tuam txhab lag luam nyob thoob ntiaj teb. Nws cov tswv yim thev naus laus zis xws li ultrasonic machining, tsib-axis txuas thiab cov txawj ntse txhim kho txhim kho txoj kev txhim kho tshiab.
