Hauv cov teb ntawm Aerospace, lub zog hluav taws xob tshiab, cov khoom siv hluav taws xob tshiab thiab kho cov roj carbon fiber ntau yam cuam tshuam nrog kev ua tau zoo thiab cov nqi tsim khoom ntawm cov khoom. Thaum ib lub tuam txhab ua tiav 6 hli tuab carbon fiber preforms, tus nqi tseem siab dua vim yog cov cuab yeej ploj thiab ntug tsis zoo nyob hauv cov txheej txheem kev txiav txim siab.
Ua cov ntsiab lus ntawm kev lag luam
Carbon fiber preforms yuav tsum txiav sab hauv sab hauv thiab sab nraud ntawm sab hauv thiab lawv cov yam ntxwv nyuaj thiab cov yam ntxwv nyuaj tso rau tom ntej nruj yuav tsum tau ua. Kev txiav txim siab txhua yam kev txiav tawm cov khoom siv peb:
Nquag chipping ntawm cov cuab yeej: Ib qho cuab yeej tsuas tuaj yeem txiav 3-5}} pieces, thiab tus nqi ntawm cov ortumables soars;
Ntau cov burrs ntawm qhov chaw txiav: Ntug delamination thiab fiber ntau teeb meem teeb meem muaj teeb meem, thiab rov ua dua tus nqi tshaj 40%;
Nkim zog: Txhawm rau kom tsis txhob chipping, qhov pub ceev yuav tsum tau txo qis, thiab lub sijhawm ua haujlwm ntawm ib daim nce ntawm 30%.
Bisen Cov Ntsiab Lus: Ultrasonic tsib-axis Linkage Technology Reshapes cov txheej txheem
Hauv kev pom ntawm cov yam ntxwv ntawm carbon fiber, bishen launched ib customized txiav daws:
Multi-Phaj Ultrasonic gantry tsib-axis khoom: Txog ntawm tsib-axis txuas, cov nyom contours tuaj yeem tsim nyob rau hauv ib qho mus, txo qhov kev ua haujlwm tsis ua yuam kev;
Ultrasonic txiav Dision Riam: 20kHz High-zaus kev co kom siv tau txiav kev txiav tawm thiab kev txwv tsis pub dhau ntawm cov txheej fiber ntau;
Ntse puv puv-txiav txiav algorithm: Txhawb nqa 6 hli puv txiav, thiab cov cuab yeej lub neej yog nce los ntawm 8 zaug.
Ib qho kev sib tsoo hauv kev ua haujlwm zoo thiab ua tau zoo
Cov ntaub ntawv tseeb tiag tiag qhia tau hais tias cov kev daws tshiab tau ua tiav peb qhov kev hloov pauv loj:
Tool Xoom Chipping: Kev txiav ntug seem tau nyob tom qab txiav 50 daim txuas ntxiv mus;
Ntug roughness tsawg dua los yog sib npaug rau ra 3.2μm: Qhov chaw txiav tuaj yeem siv ncaj qha rau cov kev sib dhos precision, tshem tawm qhov xav tau ntawm polishing theem nrab;
Efficiency tau nce los ntawm 35%: Los ntawm optimizing qhov kev co zaus thiab pub sib txuam, ib leeg-teev cov sijhawm ua haujlwm tau nias rau qib kev lag luam qib.
Txog Ntawm Bishen
Nrhiav tau nyob rau hauv 2017,Npis Xus Tsom rau cov khoom siv siab ua cov tshuab ua cov thev naus laus zis rau cov semiconductors, optics, thiab cov khoom siv kho mob. Nrog rau kev tshawb nrhiav thiab kev nthuav dav hauv Shenzhen, cov tuam txhab sib xyaw ultrasonic, ntau tus txheej txheem tswj tau, pab neeg tsim khoom lag luam hauv ntau dua 50 lub teb chaws.
